3D01600 - SEMI 3D16 - Specification for Glass Base Material for Semiconductor Packaging StdPbc-0317 NOTE 1: Although no limits

NOTE 1: Although no limits are imposed on extractable contaminants from resin pellets by this Specification

The scope of this Specification is for one grade of n-butyl acetate used in the semiconductor industry

A gas conforming to the specifications will commonly contain more of the major component than the minimum permissible limit or contain less of an impurity (or several impurities) than the SEMI C3 maximum permissible limit

and Availability of Equipment

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3D01600 - SEMI 3D16 - Specification for Glass Base Material for Semiconductor Packaging StdPbc-0317 NOTE 1: Although no limitsThis Specification is intended to address the needs of the 3D Stacked IC (3DS IC) industry by providing the tools needed to procure glass as base material to be used in a 3DS IC process or in similar applications. Such glass may be specified with or without openings for through glass vias (TGV) or blind vias (BV). This Specification describes dimensional and thermal characteristics of glass base material for interposers, RF devices, and other similar